Hoʻopaʻa Paʻa Kūʻai Kūʻai Kūʻai Kūʻē Bandolier Pin Stamping|0.3-0.64mm nā pine hoʻohui
Hana ʻia no nā pilina koʻikoʻi
I ka honua o nā mea uila -kiʻekiʻe a me nā hui electromechanical, ʻaʻole hiki ke kūkākūkā ʻia ka hilinaʻi o kēlā me kēia ʻāpana. ʻO kā mākouNā Kūlana Kūlana Kūlana pololei/Pin Bandoliersʻaʻole nā ʻāpana wale nō; ʻO lākou nā loulou kumu e hōʻoiaʻiʻo ana i ka pono o ka hōʻailona, ka hāʻawi ʻana i ka mana, a me ke kūpaʻa mechanical i kāu mau noi koi nui loa. Hana ʻia i loko o kā mākou hale hana i hōʻoia piha ʻia, i hoʻohui ʻia i ka vertically, e hōʻike ana kēia mau hopena i ke kiʻekiʻe o ka ʻenehana stamping, e hui pū ana i nā mea ʻoi aku ka maikaʻi, ka hoʻolālā mea hana kiʻekiʻe, a me ka hoʻokele kaʻina hana ikaika.
Hōʻike Kūlana Huahana
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Māhele |
Nā kikoʻī kikoʻī |
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Inoa Huahana |
ʻO ka pololei ʻo Stamping Square Terminals Bandolier Pin Stamping 0.3-0.64mm Nā Pin Hoʻohui |
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Mea Huahana |
Ke keleawe (C2600), Ke keleawe (C1100), ka Bronze Phosphor (C5191, C5210). Nā Hui Kūikawā: C18070, C7025. Keʻano: Metal Strip/Coil. |
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Papapalapala Spec |
Ke gula: 0.3-3μm no ka ASTM B488 (Ka helu kauka) Kālā: 2-5μm no 100A/in² ka nui o kēia manawa Tin: 1.5-8μm matte/satin hoʻopau |
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Hoʻokumu Mold |
Modular, Progressive Die (Continuous Stamping Die). |
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ʻenehana hana |
Kiekie -Mākini Hoʻomaʻamaʻa Holomua, Ma -Lina Mākaukau (koho). Loaʻa ka nānā ʻana i ka ʻike maka. |
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Hana Hana Hana Hana |
17 kaomi (25T-110T). Volume: miliona mau ʻāpana / mahina. ʻO ka hoʻolālā a me ka hana ʻana i nā mea hana hale piha. |
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Laulā noi kumu mua |
Kaʻa Kaʻa, Aerospace, Lapaʻau Lapaʻau, Hoʻokaʻaʻike (5G/6G) Infrastructure, Kiʻekiʻe -Reliability Industrial Controls. |
No ke aha e kū kaʻawale ai kā mākou mau pahu pahu a me nā pine bandolier
Hoʻoikaika mākou i ka hoʻololi ʻana i nā ʻāpana metala i nā mea kīnā ʻole, -kiʻekiʻe. Eia ka mea e wehewehe ai i kā mākou huahana a me ka lawelawe:
Koho Mea Pono a me ka ʻike:Hoʻohana mākou i nā ʻala -kiʻekiʻeKe keleawe (C2600), Copper (C1100), a me Phosphor Bronze (C5191, C5210, C5191). No ka pono kiʻekiʻe-ikaika, kiʻekiʻe-kokoke, hana mākou me nā huila likeC18070 (Copper Chromium Zirconium) a me C7025 (Copper Nickel Silicon). ʻO kā mākou ʻike metallurgical hohonu e hōʻoia mākou e koho i ka pae maikaʻi loa no nā koi o kāu noi no ka conductivity, nā waiwai pūnāwai, ka pale luhi, a me ka solderability. Hoʻokumu ʻia nā mea a pau mai nā wili i hōʻoia ʻia, me ka hiki ke ʻike piha.
Hana ʻia no ka pololei a me ka kūlike:Hana ʻia kēlā me kēia pahu a me nā pine e like me ka hoʻomanawanui ʻana, pinepine i loko o ± 0.005mm. Hāʻawi ka hoʻolālā terminal square i ka alignment contact kiʻekiʻe a me ke kūpaʻa i hoʻohālikelike ʻia i nā ʻano like ʻole, koʻikoʻi no ka male paʻa ʻana i nā mea hoʻohui a me nā mauna PCB. ʻO ka bandolier (ka mea lawe kaʻa) ʻo ia ka pololei-no ka hoʻomaʻamaʻa ʻana i ka ʻakomi, -wikiwiki kiʻekiʻe ka hui ʻana me ka pale ʻana i ka hoʻololi ʻana a i ʻole ke kuhi hewa ʻana.
ʻOihana Hoʻonaʻauao Kūlohelohe Kūlana kiʻekiʻe:Hoʻohana ʻia kā mākou mau peʻaHoʻolālā Modular, Make Progressive. ʻAʻole pili wale kēia hoʻolālā i ka hana; e pili ana i ka lōʻihi, ka mālama ʻana, a me ke kūpaʻa. Loaʻa nā pōmaikaʻi nui:
○ Paʻa like ʻole:Hana ʻia nā ʻāpana kumu mai nā kila mea hana premium e like meSKD11, DC53, a me -wikiwiki kiʻekiʻe nā pauka kila ASP23/ASP60/CF-H40S, e hōʻoia i ka lōʻihi o ke ola o ka mea hana ʻoiai ke hoʻopaʻa ʻana i nā mea abrasive a paʻakikī paha.
○ Hoʻoponopono maʻalahi a hoʻololi wikiwiki:Hiki i ka hoʻolālā modular ke hoʻololi i nā ʻāpana lole kūikawā (e laʻa, nā kuʻi, nā mea hoʻokomo) me ka wehe ʻole ʻana i ka make holoʻokoʻa, e hōʻemi ana i ka manawa hoʻomaha.
○ Alakaʻi ʻia e nā International Standards:Ke kūkulu nei mākou i kā mākou make iMeusburger, Hasco, a me Misuminā kūlana, e hōʻoiaʻiʻo ana i ka loaʻa ʻana o nā mea, ka hoʻololi, a me ka lawelawe honua.
○ Kiʻekiʻe-Mākini, Kiʻekiʻe-Volume Hana Hana:Me17 i hoʻolaʻa ʻia i nā kaomi hoʻopaʻa hoʻomau mau mai 25 a 110 tons, me ka pololeiNā mīkini Yamada Dobby 30T a me 40T, ua kūkulu ʻia mākou no ka unahi ʻole me ka ʻole o ka hoʻohaʻahaʻa ʻana i ka maikaʻi. Hāʻawi kēia ʻauwaʻa iā mākou e hoʻohālikelike i ka paʻi kūpono i ka paʻakikī o kāu ʻāpana a me nā koi tonnage, e hoʻonui ana i ka pono hana a me ka pono o ka ʻāpana.
○ Ma waho aʻe o ka hana ʻana: ʻO kāu hoa hana ma nā mea hana a me nā hoʻolālā:ʻO kēia kā mākou mea ʻokoʻa kumu. He amea hana mea hana kumu. ʻO kā mākou hui ʻenekinia i loko-, mema luna o 15 makahiki o ka awelika ʻike, hui pū me ʻoe mai ka manaʻo a hiki i ka hana nui.
Pehea mākou e hana ai?
ʻO kā mākou lawelawe lawelawe piha
DFM (Design for Manufacturing) Assessment
Hoʻopili mākou i kāu mau kaha kiʻi 2D/3D no ka hoʻolālā ʻana i ka hoʻolālā no ka stamping, e hōʻike ana i ka hoʻomaikaʻi ʻana no ke kumukūʻai, ka lōʻihi, a me ka hua.
01
Hoʻohālikelike ʻenekinia
Ke hoʻohana neiʻO ka nānā ʻana o CAE a me ka hoʻohālikelike kahe ʻana, wānana a hoʻemi mākou i nā pilikia kūpono e like me ka deformation, ka haki ʻana, springback, a me ke koʻikoʻi koʻikoʻi ma mua o ka ʻoki ʻana i ke kila.
02
Hoʻolālā Mea Hana Pono
Piha3D/2D mold design, a ukali ʻia e ka mīkini, ka hui ʻana, a me ka hoʻāʻo-i loko o kā mākou hale hana ponoʻī. Mālama mākou i ke kaʻina hana -holo holoʻokoʻa.
03
Hoʻopololei a me nā Holo Pilot
Hāʻawi mākou i nā laʻana no kāu hōʻoia, e hōʻoia i ka ʻāpana e hoʻokō i nā kikoʻī āpau.
04
Systematic Mass Production & Quality Assurance
Ma hope o ka ʻae ʻia, hoʻololi mākou i kā mākou laina hana kiʻekiʻe -nui, kākoʻo ʻia e kā mākou ʻōnaehana hoʻokele maikaʻi.
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Hōʻikeʻike lumi mea hana kiʻekiʻe
ʻO kā mākou hana hana a me ka hoʻohiki maikaʻi
Kūkulu ʻia kou hilinaʻi ma luna o kā mākou hiki ke hoʻopuka mau. Hoʻokūpaʻa mākou i kēia me nā waiwai a me nā palapala hōʻoia:
● Pūnaehana hoʻokele maikaʻi i hōʻoia ʻia:ʻO mākou heISO 9001:2015, IATF 16949:2016 (no ka automotive), a me ISO 14001:2015 i hōʻoia ʻiahale hana. Hoʻopili ʻia kā mākou hoʻomalu maikaʻi, -kaʻina hana, ʻaʻole he manaʻo hope.
● Hoʻopau -a-Hoʻopau i ke kaʻina hana:ʻO kā mākou ʻōnaehana SQCDP (Safety, Quality, Cost, Delivery, People) e hoʻokele i kēlā me kēia pae:
○ Nānā Mea Komo:ʻO ka hōʻoia ʻana o ka spectrometer no ka hoʻāʻo ʻana i ka waiwai a me ka mīkini.
○ Ma -Ka Mana Mana:-Nā ʻatikala mua (FAI), ka mana kaʻina hana helu (SPC) ma nā ʻāpana koʻikoʻi, a me ka hoʻopaʻa ʻana i nā mea hana maʻamau.
○ Nānā hope & OQC:ʻO nā loiloi piha e pili ana i ka nānā ʻana i ka nui koʻikoʻi Cpk, ka hoʻopau ʻana i ka ʻili, a me ka paʻa pono ʻana ma mua o ka hoʻouna ʻana.
● Hiki i ka hana a me ka ʻikepili:Me kā mākou laina 17-paʻi a me ka hana ʻekolu hoʻololi, hiki iā mākou ke hanalehulehu-miliona ʻāpana i kēlā me kēia mahinao keia mau pauku. ʻO kā mākou mea paahana maʻamau -manawa no ka make holomua paʻakikī hou8-10 pule, me ka pi'i nui 'ana -ma hope koke iho o ka 'ae 'ana mai.
Mīkini Mīkini Holomua Kiekie
| 'ikamu | ʻAno Mīkini | Brand | Aina Kumu | Tonnage | wehewehe | QTY | Huina |
| 1 | Hoʻopaʻa ʻana | ʻo Yamada | Iapana | 30T | CD25-35.Stroke No 200-1000 SPM | 1 | 17 |
| 2 | ʻo Yamada | Iapana | 40T | CD25-35.Stroke No 200-1000 SPM | 2 | ||
| 3 | Kyon | Iapana | 25T | H45DB.Stroke No 200-800 SPM | 1 | ||
| 4 | Micron | Taiwan | 25T | CD25.Stroke No 200-800 SPM | 2 | ||
| 5 | Micron | Taiwan | 30T | H30DB.Stroke No 200-1000 SPM | 2 | ||
| 6 | Micron | Taiwan | 40T | C40.Stroke No 200-800 SPM | 1 | ||
| 7 | Taijishan | Kina | 25T | TJS-25.Stroke No 200-600 SPM | 4 | ||
| 8 | ʻOpio | Kina | 40T | YSC-40.Stroke No 200-600 SPM | 1 | ||
| 9 | Kingteng | Taiwan | 110T | OCP-110N.Stroke No 50-100 SPM | 1 | ||
| 10 | Xieduan | Kina | 110T | APC-110N.Stroke No 50-100 SPM | 2 |
Hōʻike Hale Hana Stamping
Ka Papa Hana: Kahi e hālāwai ai ka pololei i ka koi
Hoʻolālā ʻia kā mākou Precision Square Terminals e hana i nā kaiapuni kahi i koho ʻole ai ka hemahema:
Kaʻa uila:ʻO nā mea hoʻohui ECU, nā hopena sensor, nā ʻāpana ʻōnaehana kukui, e koi ana i ka hoʻokō IATF 16949 a me ka hilinaʻi kiʻekiʻe ma lalo o ka vibration a me ka uila uila.
Aerospace & Palekana:Nā mea hoʻohui Avionics, nā ʻāpana ʻōnaehana kamaʻilio, kahi mea koʻikoʻi ka māmā, -ikaika kiʻekiʻe, a me ka hilinaʻi loa.
Lapaʻau Lapaʻau:ʻO nā mea hoʻohui lako diagnostic, nā ʻōnaehana kiʻi kiʻi, nā mea hoʻopili implantable, koi i ka biocompatibility (kahi i kuhikuhi ʻia) a me ka hana kīnā ʻole.
Aʻe-Kūkākūkā Gen (5G/6G Infrastructure:ʻO nā mea hoʻohui RF, nā ʻāpana kahua kahua, e koi ana i ka kūpaʻa hōʻailona maikaʻi loa a me ka lōʻihi i nā kaiapuni o waho.
ʻOihana ʻOihana, Lopako, a me ka Mea Kiʻekiʻe -Electro Consumer.
Nānā Hiʻohiʻona
Mea kūʻai
ʻEulopa Top 3 Connector mea hana
Palapala noi
Mea Hoʻohui BMS Automotive
Spec
0.5mm huinahalike pauku me 0.005mm coplanarity
Koi Makahiki
10M pcs ka nui makahiki, 0ppm pahu hopu
Ka Mana Hana Nui
● Ana CPK: 1.33~1.67(100K pcs hāpana)
● Ka hoʻomalu ʻana i ka Burr:<3μm (EIA-364-23D compliant)
● Hoʻopuka: 2M pcs / mahina no ka hoʻonohonoho make
ʻO kāu kumu hilinaʻi, ʻaʻole wale ka mea hoʻolako
ʻO ke koho ʻana iā mākou, ʻo ia hoʻi ka launa pū ʻana me kahi mea hana kumu ʻike, mākaukau, a pane. Mālama mākou i ke kaulahao holoʻokoʻa maihoʻolālā mea hana (DFM, CAE) a me ka hana ʻanaikiʻekiʻe -paʻipaʻi leoahōʻoia maikaʻi. ʻO kēia hoʻohui kūpaʻa e unuhi iʻoi aku ka maikaʻi o ke kumu kūʻai, ka mana paʻa i nā manawa alakaʻi (maʻamau 30-35 mau lā no nā kauoha nui ma hope o ka mākaukau ʻana o nā mea hana), a me ka pane like ʻole.i kāu mau pono ʻenehana a me ka logistical.
E hoʻolako mākou i kahikālele DFM manuahima kāu pahu pahu huinaha a i ʻole ka papahana hoʻopaʻa paʻi pololei. E hoʻokaʻaʻike i kā mākou hui ʻenekinia i kēia lā e kūkākūkā pehea e hiki ai iā mākou ke hoʻololi i kāu mau kikoʻī i mea hilinaʻi, kiʻekiʻe{1}}ʻoiaʻiʻo.
Nā huahana pale: bandolier pin stamping, China bandolier pin stamping mea hana, mea hoolako, hale hana
