Hoʻokomo pololei loa -no ka 24-Pin ʻAno -C Nā Mea Hoʻohui Papa
Hoʻohana i ka 120W Fast Charging & 20Gbps Data Transmission me Gen4 SI Compliance
Hoʻolālā ʻia no nā mea uila uila a me nā mea kamaʻilio, loaʻa i kā mākou mau mea hoʻohui papa 24-pin Type-C.± 0.01mm hoʻomanawanuima oʻenehana hoʻoheheʻe ʻelua-lipine hoʻokomo-.. Hooia no120W kiʻekiʻe-e hoʻouka ana i kēia manawaaʻO ka hoʻāʻo ʻana o Gen4 Signal Integrity (SI)., hā'awi 'oi aku ma mua o a i 'ole like me 99.95% o ka hua hana (i hō'oia 'ia e ka Tier 1 fast-ho'opi'i 'ikepili hana lehulehu).
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ʻĀpana |
Hōʻike |
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Inoa Huahana |
Hoʻokomo pololei loa{0}}no ka 24-Pin Type-C Board Connectors |
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Mea waiwai |
LCP E130i, ʻeleʻele(280 degere pale wela, CTE emi a like paha me 2ppm/ degere , e hōʻoia ana i ka lōʻihi -pōkole kiʻekiʻe) |
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Hoʻokumu Mold |
2-palapala poni, 16 lua + Pūnaehana holo anu + pālua -Kaʻihookomo -holoi |
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Holoi Wela |
N/A (Hoʻopaʻa ʻia ke kukini anu i ka hoʻohaʻahaʻa ʻana i ka wela LCP) |
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Kaʻina hana |
Hana 'akomi ma oNissei 80T vertical IMM(Ka manawa pōʻaiapuni ʻAʻole ma mua a i ʻole like me 15s) |
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Ka hiki |
ʻOi aku ma mua o a like paha me 2,000,000 pcs / mahina (24/7 laina automated) |
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Palapala noi |
Nā mea uila uila (kelepona/laptops), nā polokalamu 5G,120W wikiwiki -module hoʻouka |
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Ola Mold |
1,000,000+ kiʻi(Kōnae/Nā: -paʻa kila 1.2344 + nitriding) |
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Nā palapala hōʻoia |
ISO 9001, IATF 16949, ISO 14001 |
Nā Pono ʻenehana kumu
Hoʻolālā Mold Revolutionary
Pūnaehana Molding -Tape Insert{1}}Palua:
▶ ʻO ka pahu metala like ʻole/LCP hoʻoheheʻe ʻia (± 5μm kūlana pololei)
▶ 16-waha hoʻolālā + Nissei 80T IMM →UPH ʻoi aku ka nui a i ʻole like me 320 pcs(92% OEE)
Micron -Ka Papa Hana Hana
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Mea lako |
Model & Qty |
pololei |
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EDM |
Sodick AD32LS x4 |
±5μm (Ra0.1μm) |
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EDM |
Makino EDG3 x4 |
±5μm (panani EDM) |
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Uea -Oki |
Sodick AQ360Ls x4 |
±0.002mm |
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Seibu M50B x3 |
±0.002mm |
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wili pololei |
Yutong 618S x10 |
Pāpā 0.001mm/100mm |
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Ka wili ʻana |
2 ʻāpana |
Ili Ra 0.02μm |
ʻAʻohe -Kōna Manaʻo
Nānā piha -nui:
▶ Hexagon CMM Luna Nana: Nā ana koʻikoʻi CPK ʻOi aku a i ʻole like me 1.67
▶ Nikon Projectors x3: Hoʻohui like ʻia ke pine (± 1μm pololei)
▶ Wanhao 2D CMM x4: Kūlana kiʻekiʻe 100% nānā (± 0.001mm)
Hiki ke hahai:Nā ʻāpana laʻana i mālama ʻia i kēlā me kēia pūʻulu (ʻoi aku ma mua o 10 mau makahiki)
Hōʻike Hale Hana
hihia hōʻoia mea kūʻai aku
ʻAmelika ʻĀkau wikiwiki-Pahana Hoʻopaʻa inoa
Paʻakikī
93.7% hua me ka hana maʻamau; 0.3% ka pau ʻana o ke awa ma 120W
ʻO kā mākou hopena
▶ Viking steel cores (HRC 52-54) no ka pale ʻana i ke kapa
▶ Pūnaehana -ʻelua lipine e hōʻemi ana i ka hoʻololi ʻana o ka hopena (CPK: 1.1→1.8)
Ka hopena
▶ 99.98% ka nui o ka hana ʻana (ʻikepili 3 mahina)
▶ Ua hala ka USB-IF 20Gbps & Gen4 SI hoʻokō (ka palena kiʻi maka 35% ma luna o nā kikoʻī)
Hōʻike Wahi Hana
No ke aha e koho ai iā mākou?
ʻoihana
● Hoʻolālā i ka lawelawe hana nui
● Hoʻolālā uila
● Hoʻolālā mīkini
● Hoʻoponopono kaulahao hoʻolako
● Kime akamai loa i nā hoʻonā interconnectivity
ʻoluʻolu
● Hiki i nā mana prototyping wikiwiki
● Hoʻolaʻa a me nā koho hoʻoheheʻe modular
●Mass production tooling in like little as 3 weeks
● Kiʻekiʻe hui, haʻahaʻa leo hana hiki
● Kumukuai-makemake ma ka hale hana ma loko o Kina
hilinaʻi ʻia
● Kūlana kūʻai
● Aneane 16 makahiki o ka launa pū ana me ka oluolu nā mea kūʻai mai
FAQ
Nā huahana pale: hoʻokomo i ka hoʻoheheʻe ʻana no nā mea hoʻohui, hoʻokomo ʻo Kina i ka hoʻoheheʻe ʻana no nā mea hana hoʻohui, nā mea hoʻolako, nā hale hana
